Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy
dc.contributor.author | Gain, A. | |
dc.contributor.author | Zhang, L. | |
dc.contributor.author | Quadir, Md Zakaria | |
dc.date.accessioned | 2017-01-30T12:21:14Z | |
dc.date.available | 2017-01-30T12:21:14Z | |
dc.date.created | 2016-10-26T19:30:22Z | |
dc.date.issued | 2016 | |
dc.identifier.citation | Gain, A. and Zhang, L. and Quadir, M.Z. 2016. Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy. Materials and Design. 110: pp. 275-283. | |
dc.identifier.uri | http://hdl.handle.net/20.500.11937/20798 | |
dc.identifier.doi | 10.1016/j.matdes.2016.08.007 | |
dc.description.abstract |
This paper describes the changes in microstructures and their effects on property degradations in an environmentally friendly eutectic [Formula presented].7Cu (wt.%) solder alloy when subjected to harsh service conditions. A thorough microscopy investigation was conducted by scanning electron microscopy (SEM), electron backscattered diffraction (EBSD) and diffraction analysis with transmission electron microscopy (TEM). In the as-received alloy Cu6Sn5 intermetallic compound (IMC) particles are dispersed in the grain interiors and grain boundaries of ß-Sn matrix. When the alloy was exposed for 60 days at 150 °C, the size of Cu6Sn5 IMC particles and Sn matrix grains were increased significantly. As a result the mechanical reliability of electronic interconnections turned inferior. This was confirmed by measuring a range of electrical and mechanical properties that include electrical resistivity, Young's moduli, shear moduli, microhardness and nano indentation creep behaviour. A comparison between the as-received and age-treated alloy shows that the degradation in Young's and shear moduli was about 10.6 and 9.9%, respectively, and that in hardness was about 25%. However the age treatment improved the damping property of the alloy. | |
dc.publisher | Elsevier | |
dc.title | Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy | |
dc.type | Journal Article | |
dcterms.source.volume | 110 | |
dcterms.source.startPage | 275 | |
dcterms.source.endPage | 283 | |
dcterms.source.issn | 0264-1275 | |
dcterms.source.title | Materials and Design | |
curtin.department | John de Laeter CoE in Mass Spectrometry | |
curtin.accessStatus | Fulltext not available |
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