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dc.contributor.authorChandratilleke, Tilak
dc.contributor.authorRakshit, D.
dc.contributor.editorKeyun Bi, Mingliang Huang and Ning Zhao
dc.date.accessioned2017-01-30T13:02:59Z
dc.date.available2017-01-30T13:02:59Z
dc.date.created2014-03-24T20:00:47Z
dc.date.issued2013
dc.identifier.citationChandratilleke, Tilak and Rakshit, Dibakar. 2013. A Synthetic Jet Heat Sink with Cross-flow for Electronic Cooling, in Bi, K. and Huang, M. and Zhao, N. (ed), 2013 14th International Conference on Electronic Packaging Technology (ICEPT), Aug 11-14 2013, pp. 91-95. Dalian, China: IEEE.
dc.identifier.urihttp://hdl.handle.net/20.500.11937/28083
dc.identifier.doi10.1109/ICEPT.2013.6756430
dc.description.abstract

This paper presents an investigation on the operational characteristics and thermal effectiveness of a pulsed (or synthetic) jet mechanism that periodically cools at a heated surface while acting in cross-flow fluid stream. The study uses a test rig having a variable-frequency pulsed air jet impinging at a heated surface that emulates an electronic device to be cooled. The cooling characteristics of the jet are observed over a wide parametric range. The results show that the pulsed jet mechanism delivers outstanding cooling performance that is primarily dependent on the jet-impinging distance and operating frequency. Without cross flow, the pulsed jet provides about 11 K temperature reduction and 7 times more heat removal rate compared to natural convection at the heated surface. The jet impingement height indicates a strong dependency with an optimum on the heat removal rate. With cross-flow fluid stream, the pulsed jet cooling is enhanced. This combined fluid action achieves about 13 K temperature drop and delivers 2.2 times more cooling compare to pulsed jet operating alone. The pulsed jet operation is numerically simulated to understand the associated flow characteristics leading to thermal enhancement. It is recognised that the pulsed jet arrangement has the unique surface cooling ability without additional fluid circuits, making it particularly desirable for high-capacity electronic cooling applications.

dc.publisherIEEE
dc.titleA Synthetic Jet Heat Sink with Cross-flow for Electronic Cooling
dc.typeConference Paper
dcterms.source.startPage91
dcterms.source.endPage95
dcterms.source.titleProceedings of the 14th International Conference on Electronic Packaging Technology(ICEPT 2013)
dcterms.source.seriesProceedings of the 14th International Conference on Electronic Packaging Technology(ICEPT 2013)
dcterms.source.isbn978-1-4799-0497-6
dcterms.source.conference2013 14th International Conference on Electronic Packaging Technology(ICEPT 2013)
dcterms.source.conference-start-dateAug 11 2013
dcterms.source.conferencelocationDalian, China
dcterms.source.placeDalian University of Technology, China
curtin.department
curtin.accessStatusFulltext not available


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