Thermal Mismatch Stresses in Electronic Packaging
| dc.contributor.author | Debnath, Sujan | |
| dc.date.accessioned | 2017-01-30T13:35:41Z | |
| dc.date.available | 2017-01-30T13:35:41Z | |
| dc.date.created | 2015-03-03T20:16:09Z | |
| dc.date.issued | 2011 | |
| dc.identifier.citation | Debnath, S. 2011. Thermal Mismatch Stresses in Electronic Packaging. Germany: Lambert Academic Publishing. | |
| dc.identifier.uri | http://hdl.handle.net/20.500.11937/33216 | |
| dc.publisher | Lambert Academic Publishing | |
| dc.title | Thermal Mismatch Stresses in Electronic Packaging | |
| dc.type | Book | |
| dcterms.source.isbn | 978-3-8465-0505-2 | |
| dcterms.source.place | Germany | |
| curtin.department | Curtin Sarawak | |
| curtin.accessStatus | Fulltext not available |