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    Effect of solute clusters on stress relaxation behavior in Cu-Ni-P alloys

    Access Status
    Fulltext not available
    Authors
    Aruga, Y.
    Saxey, David
    Marquis, E.
    Shishido, H.
    Sumino, Y.
    Cerezo, A.
    Smith, G.
    Date
    2009
    Type
    Conference Paper
    
    Metadata
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    Citation
    Aruga, Y. and Saxey, D. and Marquis, E. and Shishido, H. and Sumino, Y. and Cerezo, A. and Smith, G. 2009. Effect of solute clusters on stress relaxation behavior in Cu-Ni-P alloys, pp. 2888-2900.
    Source Title
    Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
    DOI
    10.1007/s11661-009-0025-9
    ISSN
    1073-5623
    School
    John de Laeter CoE in Mass Spectrometry
    URI
    http://hdl.handle.net/20.500.11937/35877
    Collection
    • Curtin Research Publications
    Abstract

    In this study, the ultrafine structures in Cu-P and Cu-Ni-P alloys have been characterized using a three-dimensional atom probe (3DAP) and transmission electron microscopy (TEM), and the stress relaxation behavior of these alloys has been explored. The results show that low-temperature annealing greatly improved the stress relaxation performance, especially in the Cu-Ni-P alloys. The presence of Ni-P clusters in the Cu-Ni-P alloys has been revealed. The overall improvement in properties has been analyzed in terms of variations in the dislocation density and solute atom cluster density within these materials. It is shown that clusters with small average spacing give rise to significant improvements in the stress relaxation performance, without requiring significant change in the dislocation density. © 2009 The Minerals, Metals & Materials Society and ASM International.

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