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dc.contributor.authorGuenette, M.
dc.contributor.authorTucker, Mark
dc.contributor.authorIonescu, M.
dc.contributor.authorBilek, M.
dc.contributor.authorMcKenzie, D.
dc.date.accessioned2017-01-30T14:32:20Z
dc.date.available2017-01-30T14:32:20Z
dc.date.created2014-11-19T01:13:30Z
dc.date.issued2010
dc.identifier.citationGuenette, M. and Tucker, M. and Ionescu, M. and Bilek, M. and McKenzie, D. 2010. Cathodic arc co-deposition of highly oriented hexagonal Ti and Ti2AlC MAX phase thin films. Thin Solid Films. 519: pp. 766-769.
dc.identifier.urihttp://hdl.handle.net/20.500.11937/39269
dc.description.abstract

Ti2AlC belongs to a family of ternary nanolaminate alloys known as the MAX phases, which exhibit a uniquecombination of metallic and ceramic properties. Here we report pulsed cathodic arc deposition of c axisnormal oriented Ti2AlC thin films on a-Al2O3 (001) single crystal substrates heated to 900 °C, without anintentionally pre-deposited seed layer. Oriented hexagonal Ti is observed in some films and an in-planeepitaxial relationship between the a-Al2O3 (001) substrate, the hexagonal Ti and Ti2AlC MAX phase isobserved. We observe formation of the Ti2AlC phase in all films despite variations in elemental composition.The electrical resistivity of our films was in the range 0.48–0.67 µO m, higher than other values found forTi2AlC in the literature.

dc.publisherElsevier S.A.
dc.titleCathodic arc co-deposition of highly oriented hexagonal Ti and Ti2AlC MAX phase thin films
dc.typeJournal Article
dcterms.source.volume519
dcterms.source.startPage766
dcterms.source.endPage769
dcterms.source.issn0040-6090
dcterms.source.titleThin Solid Films
curtin.accessStatusFulltext not available


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