Characterisation of the interface adhesion of elastic-plastic thin film/rigid substrate systems using a pressurized blister test numerical model

dc.contributor.author	Jiang, L.
dc.contributor.author	Zhou, Y.
dc.contributor.author	Hao, H.
dc.contributor.author	Liao, Y.
dc.contributor.author	Lu, Chungsheng
dc.date.accessioned	2017-01-30T15:19:05Z
dc.date.available	2017-01-30T15:19:05Z
dc.date.created	2010-10-28T20:02:54Z
dc.date.issued	2010
dc.identifier.citation	Jiang, Limei and Zhou, Yichun and Hao, Hongxiao and Liao, Yanguo and Lu, Chungsheng. 2010. Characterisation of the interface adhesion of elastic-plastic thin film/rigid substrate systems using a pressurized blister test numerical model. Mechanics of Materials. 42 (10): pp. 908-915.
dc.identifier.uri	http://hdl.handle.net/20.500.11937/45166
dc.identifier.doi	10.1016/j.mechmat.2010.07.009
dc.publisher	Elsevier Ltd
dc.title	Characterisation of the interface adhesion of elastic-plastic thin film/rigid substrate systems using a pressurized blister test numerical model
dc.type	Journal Article
dcterms.source.volume	42
dcterms.source.number	10
dcterms.source.startPage	908
dcterms.source.endPage	915
dcterms.source.issn	0167-6636
dcterms.source.title	Mechanics of Materials
curtin.note	The link to the journal’s home page is: http://www.elsevier.com/wps/find/journaldescription.cws_home/505659/description#description. Copyright © 2010 Elsevier B.V. All rights reserved
curtin.accessStatus	Open access
curtin.faculty	School of Engineering
curtin.faculty	Faculty of Science and Engineering
curtin.faculty	Department of Mechanical Engineering