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    Vacuum-assisted electroless copper plating on Ni/(Sm,Ce)O2 anodes for intermediate temperature solid oxide fuel cells

    Access Status
    Fulltext not available
    Authors
    Ai, Na
    Chen, Kongfa
    Jiang, San Ping
    Lu, Z.
    Su, W.
    Date
    2011
    Type
    Journal Article
    
    Metadata
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    Citation
    Ai, N. and Chen, K. and Jiang, S.P. and Lu, Z. and Su, W. 2011. Vacuum-assisted electroless copper plating on Ni/(Sm,Ce)O2 anodes for intermediate temperature solid oxide fuel cells. International Journal of Hydrogen Energy. 36: pp. 7661-7669.
    Source Title
    International Journal of Hydrogen Energy
    DOI
    10.1016/j.ijhydene.2011.03.131
    ISSN
    03603199
    School
    Department of Chemical Engineering
    URI
    http://hdl.handle.net/20.500.11937/4728
    Collection
    • Curtin Research Publications
    Abstract

    Cu is incorporated by vacuum-assisted electroless plating into porous Ni/Sm0.2Ce0.8O1.9 (Ni/SDC) anodes as the active anodes for the oxidation reaction of hydrogen and methane of intermediate temperature solid oxide fuel cells (IT-SOFCs). The scanning electron microscopy (SEM) observation indicates the formation of a uniformly distributed nanostructured Cu network within the porous Ni/SDC microstructure. The maximum power density of the cell with the Cu electroless-plated Ni/SDC anodes is 0.84 and 0.54 W cm2 in dry H2 and dry CH4 at 600 C, respectively, enhanced by w30% as compared to the cell with conventional Ni/SDC anodes. The increase in the performance of the cell with the Cu electroless-plated Ni/SDC anodes is most likely attributed to the enlarged effective threephaseboundaries (TPBs) by interconnecting the isolated Ni and/or SDC particles with the electroless-plated Cu network and the formation of TPBs at the Cu/SDC interface due to the activation of SDC surface by the Cu deposition. The stability test shows that cell degradation in dry methane due to carbon deposition is significantly reduced by the electroless copper plating.

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