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    Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride

    Access Status
    Fulltext not available
    Authors
    Lee, S.
    Yoo, Kyoungkeun
    Jha, M.
    Lee, J.
    Date
    2015
    Type
    Journal Article
    
    Metadata
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    Citation
    Lee, S. and Yoo, K. and Jha, M. and Lee, J. 2015. Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride. Hydrometallurgy. 157: pp. 184-187.
    Source Title
    Hydrometallurgy
    DOI
    10.1016/j.hydromet.2015.08.016
    ISSN
    0304-386X
    School
    Dept of Mining Eng & Metallurgical Eng
    URI
    http://hdl.handle.net/20.500.11937/53385
    Collection
    • Curtin Research Publications
    Abstract

    A recycling process consisting of hydrochloric acid leaching with ferric chloride as an oxidant and cementation using Sn powder followed by solvent extraction was proposed to separate Sn from Pb-free solder. Leaching tests showed that the effect of HCl concentration on the leaching efficiency of Sn was negligible in 1.0-2.0 kmol · m<sup>- 3</sup> HCl, and the efficiency was lower at 0.5 kmol · m<sup>- 3</sup> HCl. Higher temperature yielded higher dissolution rates of Sn and Cu in the beginning of leaching; the leaching efficiencies of Sn and Cu increased to more than 99% within 90 min, but Ag was not detected, indicating that Ag could be separated successfully from Sn and Cu. When more than 1 g of Sn powder was added to 100 ml of leach solution containing 98.1 g · m<sup>- 3</sup> Cu, Cu ions could be removed from the leach solution by the cementation reaction. In the solvent extraction test using tri-butyl phosphate (TBP) diluted with kerosene, the extraction efficiency of Sn increased with increasing TBP volume ratio in the organic phase, and 99.9% of Sn was extracted selectively by 3-time solvent extraction with 15% TBP and 1:1 O/A ratio at 30 °C.

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