Curtin University Homepage
  • Library
  • FAQ
    • Log in

    espace - Curtin’s institutional repository

    JavaScript is disabled for your browser. Some features of this site may not work without it.
    View Item 
    • espace Home
    • espace
    • Curtin Research Publications
    • View Item
    • espace Home
    • espace
    • Curtin Research Publications
    • View Item

    Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate

    Access Status
    Fulltext not available
    Authors
    Tay, S.
    Haseeb, A.
    Johan, M.
    Munroe, P.
    Quadir, Md Zakaria
    Date
    2013
    Collection
    • Curtin Research Publications
    Type
    Journal Article
    Metadata
    Show full item record
    Abstract

    This paper reports on the effects of adding Ni nanoparticles to a Sn-3.8Ag-0.7Cu solder. The nanocomposite was prepared by manual blending of SAC solder paste with various percentages of Ni particles. Results showed that the addition of Ni nanoparticles did not bring any significant change in the onset melting temperature of the solder. An increase in the weight percentage of nanoparticles in the solder caused an increase of the wetting angle and a decrease of spreading rate. Moreover, the addition of Ni nanoparticles changed the interfacial intermetallic compound morphology from a scalloped structure into a planar type structure, enhanced the growth of (Cu,Ni)6Sn 5 and suppressed that of Cu3Sn. The concentration of Ni in (Cu,Ni)6Sn5 was higher at the solder side compared with the substrate side. No nickel was detected in the Cu3Sn phase. Ni nanoparticle additions caused an increase in the interdiffusion coefficient in (Cu,Ni)6Sn5, but a reduction in Cu3Sn. All these effects found in the Ni nanoparticle doped solder are similar to the case when Ni is added as an alloying element. Hence, it is suggested that Ni nanoparticles dissolve into the molten solder and influence the intermetallic compound formation through conventional alloying effects.

    Citation
    Tay, S. and Haseeb, A. and Johan, M. and Munroe, P. and Quadir, M.Z. 2013. Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate. Intermetallics. 33: pp. 8-15.
    Source Title
    Intermetallics
    URI
    http://hdl.handle.net/20.500.11937/53696
    DOI
    10.1016/j.intermet.2012.09.016
    Department
    John de Laeter Centre

    Related items

    Showing items related by title, author, creator and subject.

    • Recovery of Sn, Ag and Cu from waste Pb-free solder using nitric acid leaching
      Yoo, Kyoungkeun; Lee, J.; Lee, K.; Kim, B.; Kim, M.; Kim, S.; Pandey, B. (2012)
      The development of a hydrometallurgical process for the recycling of waste Pb-free solder based on nitric acid leaching, followed by the separation of Ag and Cu through AgCl precipitation or cementation, was investigated. ...
    • Leaching of tin from waste Pb-free solder in hydrochloric acid solution with stannic chloride
      Kim, S.; Lee, J.; Yoo, Kyoungkeun (2016)
      A hydrochloric acid (HCl) leaching process with stannic chloride (SnCl4) was proposed to leach Sn from waste Pb-free solder containing Sn, Ag, and Cu, where the oxidant stannic ion (Sn4 +) oxidizes Sn metal into stannous ...
    • Synthesis of polymeric nanocomposite membranes for aqueous and non-aqueous media
      Rajaeian, Babak (2012)
      Thin film composite (TFC) membranes have long been used by many large-scale applications (i.e., water and wastewater treatment). Recently, conventional polymeric TFC membranes are facing with short longevity due to high ...
    Advanced search

    Browse

    Communities & CollectionsIssue DateAuthorsTitlesSubjectsDocument TypesThis CollectionIssue DateAuthorsTitlesSubjectsDocument Types

    My Account

    Log in

    Statistics

    Most Popular ItemsStatistics by CountryMost Popular Authors

    Connect with Curtin

    • 
    • 
    • 
    • 
    • 
    • 
    • 

    CRICOS Provider Code: 00301JABN: 99 143 842 569TEQSA: PRV12158

    Send FeedbackContact Us
    DSpace software copyright © 2002-2015  DuraSpace