Numerical study on interaction of surface cracking and interfacial delamination in thermal barrier coatings under tension
MetadataShow full item record
The interaction of surface cracking and interfacial delamination in thermal barrier coatings under tension is investigated by using a cohesive zone finite element model. It is found that the surface crack density has a significant effect on the initiation and propagation of interfacial delamination. The interfacial delamination length decreases with increase of the surface crack density. The influence of ceramic coating thickness and interfacial adhesion parameters on surface cracking and interfacial delamination is discussed. It is shown that the saturated crack densities decrease with increase of the ceramic coating thickness and interfacial delamination length, and the critical surface crack density without interfacial delamination decreases as the interfacial adhesion energy increases. The results imply that the larger the surface crack density and interfacial adhesion energy are, the less the probability of interfacial delamination.
Showing items related by title, author, creator and subject.
Yao, W.; Dai, C.; Mao, W.; Lu, Chungsheng; Yang, L.; Zhou, Y. (2012)An acoustic emission technique was used to monitor the cracking behavior and fracture process of thermal barrier coatings subjected to tensile loading. Acoustic emission signals were extracted and preformed by fast Fourier ...
Determination of interfacial adhesion energies of thermal barrier coatings by compression test combined with a cohesive zone finite element modelZhu, W.; Yang, L.; Guo, J.; Zhou, Y.; Lu, Chunsheng (2015)Determination of interfacial adhesion energies of thermal barrier coatings is important for understanding failure mechanisms and predicting their lifetime. Combined compression test with a cohesive zone finite element ...
Yang, L.; Zhong, Z.; Zhou, Y.; Zhu, W.; Zhang, Z.; Cai, C.; Lu, Chunsheng (2016)© 2015, The Chinese Society of Theoretical and Applied Mechanics; Institute of Mechanics, Chinese Academy of Sciences and Springer-Verlag Berlin Heidelberg.In this paper, acoustic emission (AE) and digital image correlation ...