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    Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging

    Access Status
    Fulltext not available
    Authors
    Quadir, Zakaria
    Singh, G.
    Rickard, William
    Haseeb, A.S.M.A.
    Date
    2020
    Type
    Journal Article
    
    Metadata
    Show full item record
    Citation
    Quadir, M.Z. and Singh, G. and Rickard, W.D.A. and Haseeb, A.S.M.A. 2020. Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging. Materials Letters. 259: Article No. 126833.
    Source Title
    Materials Letters
    DOI
    10.1016/j.matlet.2019.126833
    ISSN
    0167-577X
    Faculty
    Faculty of Science and Engineering
    School
    John de Laeter CoE in Mass Spectrometry
    John de Laeter Centre (JdLC)
    URI
    http://hdl.handle.net/20.500.11937/82057
    Collection
    • Curtin Research Publications
    Abstract

    © 2019 Elsevier B.V. This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves simultaneous application of laser heat and ultrasonic pressure. The beneficial effects of laser heating are apparent to overcoming the processing challenges associated with high hardness of copper. The application of laser yields columnar gains and grain size gradient. The laser-assisted samples have undergone a different deformation mechanism which is indicated by the non-localized nature of deformation. The dynamic thermal restorations in the laser-assisted sample are obvious.

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