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    Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method

    Access Status
    Open access via publisher
    Authors
    Wang, Z.
    Ma, Z.
    Zhou, Y.
    Lu, Chunsheng
    Date
    2013
    Type
    Journal Article
    
    Metadata
    Show full item record
    Citation
    Wang, Zihan and Ma, Zengsheng and Zhou, Yichun and Lu, Chunsheng. 2013. Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method. Progress in Natural Science: Materials International. 23 (5): pp. 453-458.
    Source Title
    Progress in Natural Science: Materials International
    DOI
    10.1016/j.pnsc.2013.08.001
    ISSN
    1002-0071
    URI
    http://hdl.handle.net/20.500.11937/20980
    Collection
    • Curtin Research Publications
    Abstract

    To characterize the mechanical properties of thin films, an improved blister method is proposed, which combines a digital speckle correlation method with the blister test. Based on this method, an experimental setup is developed to measure Young's modulus, residual stress, and interfacial adhesion energy of an electroplated nickel film. The results show that the improved blister method has the advantage of a high accuracy full-field measurement with the simple operation and low requirement on environments, which can be used to characterize the mechanical properties of films with various scales from laboratorial to industrial applications.

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