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dc.contributor.authorWang, Z.
dc.contributor.authorMa, Z.
dc.contributor.authorZhou, Y.
dc.contributor.authorLu, Chunsheng
dc.date.accessioned2017-01-30T12:22:28Z
dc.date.available2017-01-30T12:22:28Z
dc.date.created2013-11-25T20:00:38Z
dc.date.issued2013
dc.identifier.citationWang, Zihan and Ma, Zengsheng and Zhou, Yichun and Lu, Chunsheng. 2013. Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method. Progress in Natural Science: Materials International. 23 (5): pp. 453-458.
dc.identifier.urihttp://hdl.handle.net/20.500.11937/20980
dc.identifier.doi10.1016/j.pnsc.2013.08.001
dc.description.abstract

To characterize the mechanical properties of thin films, an improved blister method is proposed, which combines a digital speckle correlation method with the blister test. Based on this method, an experimental setup is developed to measure Young's modulus, residual stress, and interfacial adhesion energy of an electroplated nickel film. The results show that the improved blister method has the advantage of a high accuracy full-field measurement with the simple operation and low requirement on environments, which can be used to characterize the mechanical properties of films with various scales from laboratorial to industrial applications.

dc.publisherElsevier B.V.
dc.subjectresidual stress
dc.subjectyoung's modulus
dc.subjectinterfacial adhesion energy
dc.subjectblister test
dc.subjectdigital speckle correlation method
dc.titleMeasurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method
dc.typeJournal Article
dcterms.source.volume23
dcterms.source.number5
dcterms.source.startPage453
dcterms.source.endPage458
dcterms.source.issn1002-0071
dcterms.source.titleProgress in Natural Science: Materials International
curtin.department
curtin.accessStatusOpen access via publisher


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