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Size and volume effects on the strength of microscale lead-free solder joints

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Authors
Yin, L.
Zhang, X.
Lu, Chungsheng
Date
2009
Type
Journal Article

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Yin, L. and Zhang, X. and Lu, Chungsheng. 2009. Size and volume effects on the strength of microscale lead-free solder joints. Journal of Electronic Materials. 38 (10): pp. 2179-2183.
Source Title
Journal of Electronic Materials
DOI
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Faculty
Faculty of Science and Engineering
Department of Mechanical Engineering
School of Civil and Mechanical Engineering
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The original publication is available at: http://www.springerlink.com

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Abstract

The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints of different sizes was investigated under quasistatic microtension loading. The experimental results show that the ultimate tensile strength of a joint does not always increase with decreasing thickness-to-diameter ratio (d/t), which is commonly regarded as the dominant factor for mechanical constraint in the joint. A clear joint volume effect on the strength has been found, i.e., the joint's strength increases with decreasing joint volume and the correlation follows an inverse proportional function reasonably well.