Size and volume effects on the strength of microscale lead-free solder joints
| dc.contributor.author | Yin, L. | |
| dc.contributor.author | Zhang, X. | |
| dc.contributor.author | Lu, Chungsheng | |
| dc.date.accessioned | 2017-01-30T12:29:41Z | |
| dc.date.available | 2017-01-30T12:29:41Z | |
| dc.date.created | 2009-08-23T20:02:21Z | |
| dc.date.issued | 2009 | |
| dc.identifier.citation | Yin, L. and Zhang, X. and Lu, Chungsheng. 2009. Size and volume effects on the strength of microscale lead-free solder joints. Journal of Electronic Materials. 38 (10): pp. 2179-2183. | |
| dc.identifier.uri | http://hdl.handle.net/20.500.11937/22157 | |
| dc.identifier.doi | 10.1007/s11664-009-0858-4 | |
| dc.description.abstract |
The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints of different sizes was investigated under quasistatic microtension loading. The experimental results show that the ultimate tensile strength of a joint does not always increase with decreasing thickness-to-diameter ratio (d/t), which is commonly regarded as the dominant factor for mechanical constraint in the joint. A clear joint volume effect on the strength has been found, i.e., the joint's strength increases with decreasing joint volume and the correlation follows an inverse proportional function reasonably well. | |
| dc.publisher | Springer | |
| dc.title | Size and volume effects on the strength of microscale lead-free solder joints | |
| dc.type | Journal Article | |
| dcterms.source.volume | 38 | |
| dcterms.source.number | 10 | |
| dcterms.source.startPage | 2179 | |
| dcterms.source.endPage | 2183 | |
| dcterms.source.issn | 03615235 | |
| dcterms.source.title | Journal of Electronic Materials | |
| curtin.note |
The original publication is available at: | |
| curtin.accessStatus | Fulltext not available | |
| curtin.faculty | Faculty of Science and Engineering | |
| curtin.faculty | Department of Mechanical Engineering | |
| curtin.faculty | School of Civil and Mechanical Engineering |