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Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change

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Authors
Debnath, Sujan
Woldemichael, Dereje
Murthy, M.
Seetharamu, K.
Date
2011
Type
Journal Article

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Debnath, S. and Woldemichael, D. and Murthy, M. and Seetharamu, K. 2011. Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change. Journal of Electronic Packaging. 133 (4): pp. 041014-1-041014-6.
Source Title
Journal of Electronic Packaging
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Curtin Sarawak
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