Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change
| dc.contributor.author | Debnath, Sujan | |
| dc.contributor.author | Woldemichael, Dereje | |
| dc.contributor.author | Murthy, M. | |
| dc.contributor.author | Seetharamu, K. | |
| dc.date.accessioned | 2017-01-30T13:12:43Z | |
| dc.date.available | 2017-01-30T13:12:43Z | |
| dc.date.created | 2015-03-03T20:16:09Z | |
| dc.date.issued | 2011 | |
| dc.identifier.citation | Debnath, S. and Woldemichael, D. and Murthy, M. and Seetharamu, K. 2011. Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change. Journal of Electronic Packaging. 133 (4): pp. 041014-1-041014-6. | |
| dc.identifier.uri | http://hdl.handle.net/20.500.11937/29416 | |
| dc.identifier.doi | 10.1115/1.4005294 | |
| dc.publisher | ASME | |
| dc.title | Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change | |
| dc.type | Journal Article | |
| dcterms.source.volume | 133 | |
| dcterms.source.number | 4 | |
| dcterms.source.startPage | 041014 | |
| dcterms.source.endPage | 1 | |
| dcterms.source.issn | 1043-7398 | |
| dcterms.source.title | Journal of Electronic Packaging | |
| curtin.department | Curtin Sarawak | |
| curtin.accessStatus | Fulltext not available |