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    An analytical model for the thermal conductivity of silicon nanostructures

    19461_downloaded_stream_553.pdf (120.0Kb)
    Access Status
    Open access
    Authors
    Gale, Julian
    Chantrenne, P.
    Barrat, J.
    Blase, X.
    Date
    2005
    Type
    Journal Article
    
    Metadata
    Show full item record
    Citation
    Gale, Julian and Chantrenne, P. and Barrat, J.L. and Blase, X.. 2005. An analytical model for the thermal conductivity of silicon nanostructures. Journal of Applied Physics 97: 104318-1.
    Source Title
    Journal of Applied Physics
    DOI
    10.1063/1.1898437
    Additional URLs
    http://jap.aip.org/
    Faculty
    Department of Applied Chemistry
    Division of Engineering, Science and Computing
    Faculty of Science
    Remarks

    (c) American Institute of Physics

    This article originally published in the journal:

    Journal of Applied Physics

    An analytical model for the thermal conductivity of silicon nanostructures, Gale, Julian and Chantrenne, P. and Barrat, J.L. and Blase, X. (2005) Journal of Applied Physics 97:104318-1.

    URI
    http://hdl.handle.net/20.500.11937/34884
    Collection
    • Curtin Research Publications
    Abstract

    A simple model of thermal conductivity, based on the harmonic theory of solids, is used to study the heat transfer in nanostructures. The thermal conductivity is obtained by summing the contribution of all the vibration modes of the system. All the vibrational properties (dispersion curves and relaxation time) that are used in the model are obtained using the data for bulk samples. The size effeect is taaken into account through the sampling of the Brillouin zone and the distance that a wave vector can travel between two boundaries in the structure. The model is used to predict the thermal conductivity of silicon nanowires and nanofilms, and demonstrates a good agreement with experimental results. Finally, using this model, the quality of the silicon interatomic potential, used for molecular-dynamics simulations of heat transfer, is evaluated

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