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    Performance of Solder Bond on Thermal Mismatch Stresses in Electronic Packaging Assembly

    Access Status
    Fulltext not available
    Authors
    Debnath, Sujan
    Pang, X.
    Rahman, Muhammad
    Moola, Mohan
    Date
    2014
    Collection
    • Curtin Research Publications
    Type
    Journal Article
    Metadata
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    Abstract

    Thermo-mechanical stresses have been considered one of the major concerns in electronic Packaging assembly structural failure. The interfacial stresses are often caused by the thermal mismatch stresses induced by the coefficient of thermal expansion (CTE) difference between materials, typically during the high temperature change in the bonding process. This research work examined the effect of bond layer on thermal mismatch interfacial stresses in a bi-layered assembly. The paper verified the existing thermal mismatch solder bonded bi-layered analytical model using finite element method (FEM) simulation. The parametric studies were carried out on the effect of change of bond layer properties in order to provide useful references for interfacial stress evaluation and the electronic packaging assembly design. These parameters included CTE, temperature, thickness, and stiffness (compliant and stiff bond) of the bond layer. The recent development on lead free bonding material was being reviewed and found to have enormous potential and key role to address the future electronic packaging assembly reliability.

    Citation
    Debnath, S. and Pang, X. and Rahman, M. and Moola, M. 2014. Performance of Solder Bond on Thermal Mismatch Stresses in Electronic Packaging Assembly. Materials Science Forum. 773-774: pp. 242-249.
    Source Title
    Materials Science Forum
    URI
    http://hdl.handle.net/20.500.11937/36966
    DOI
    10.4028/www.scientific.net/MSF.773-774.242
    Department
    Curtin Sarawak

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