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    Recent Development in the Topologies for Photovoltaic Module Integrated Converters

    136228_136228.pdf (707.1Kb)
    Access Status
    Open access
    Authors
    Li, Q.
    Wolfs, Peter
    Date
    2006
    Type
    Conference Paper
    
    Metadata
    Show full item record
    Citation
    Li, Q. and Wolfs, Peter. 2006. Recent Development in the Topologies for Photovoltaic Module Integrated Converters, in Unknown (ed), Power Electronics Specialists Conference, 2006. PESC '06. 37th IEEE, Jun 18 2006, pp. 1-8. Jeju, Korea: IEEE.
    Source Title
    Power Electronics Specialists Conference, 2006. PESC '06. 37th IEEE
    Source Conference
    Power Electronics Specialists Conference, 2006. PESC '06. 37th IEEE
    ISSN
    0275-9306
    Faculty
    Department of Electrical and Computer Engineering
    School of Engineering
    Faculty of Science and Engineering
    Remarks

    Copyright © 2006 IEEE This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.

    URI
    http://hdl.handle.net/20.500.11937/48057
    Collection
    • Curtin Research Publications
    Abstract

    The annual world PV cell/module production is growing at almost an exponential rate and has reached 1727 MW in 2005. Building integrated PV (BIPV) projects are emerging as the strongest part of the PV market and grid interactive inverters are a key component in determining the total system cost. Module integrated converter (MIC) technology is one approach that may assist in driving down the balance of system costs to secure an improved total system cost. This paper concentrates on the topology study of the photovoltaic MICs in the power range below 500 W and covers most topologies recently proposed for MIC applications. The MIC topologies are classified into three different arrangements based on the dc link configurations. A systematic discussion is also provided at the end of the paper that focuses on the major advantages and disadvantages of each MIC arrangement. These are considered in detail and will provide a useful framework and point of reference for the next generation MIC designs and applications

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