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dc.contributor.authorBorrero-Lõpez, O.
dc.contributor.authorVodenitcharova, T.
dc.contributor.authorQuadir, Md Zakaria
dc.contributor.authorHoffman, M.
dc.date.accessioned2017-06-23T02:59:24Z
dc.date.available2017-06-23T02:59:24Z
dc.date.created2017-06-19T03:39:34Z
dc.date.issued2015
dc.identifier.citationBorrero-Lõpez, O. and Vodenitcharova, T. and Quadir, M.Z. and Hoffman, M. 2015. Scratch Fracture of Polycrystalline Silicon Wafers. Journal of the American Ceramic Society. 98 (8): pp. 2587-2594.
dc.identifier.urihttp://hdl.handle.net/20.500.11937/53286
dc.identifier.doi10.1111/jace.13620
dc.description.abstract

Fracture of silicon wafers is responsible for lower than desirable manufacturing yields in the photovoltaic industry. This study investigates the fracture response of polycrystalline silicon wafers under sliding contacts at different length scales, by means of macro and microscratch tests which simulate cutting processes. The dominant fracture modes were found to be partial cone cracking (macro) and radial cracking (micro). Statistical analysis of the critical loads for crack initiation showed that polycrystalline wafers are weaker than their single-crystal counterparts, that is, they crack at lower applied loads under comparable conditions. Moreover, the Weibull modulus of polycrystalline silicon was found to be the average of the relevant single-crystal directions. Subsequent microscopic observations and flexure tests reveal that the lower resistance of polycrystalline silicon to scratch fracture is due mainly to the presence of relatively large polishing defects, and not to the weakness of its grain boundaries. Alternatives are proposed to minimize damage during ingot cutting, with a view to minimizing wafer breakages during wafer handling and machining.

dc.publisherWiley-Blackwell Publishing, Inc.
dc.titleScratch Fracture of Polycrystalline Silicon Wafers
dc.typeJournal Article
dcterms.source.volume98
dcterms.source.number8
dcterms.source.startPage2587
dcterms.source.endPage2594
dcterms.source.issn0002-7820
dcterms.source.titleJournal of the American Ceramic Society
curtin.departmentJohn de Laeter Centre
curtin.accessStatusFulltext not available


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