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    Separation of Cu, Sn, Pb from copper scrap coated with Sn and Pb

    Access Status
    Fulltext not available
    Authors
    Yoo, Kyoungkeun
    Moon, G.
    Date
    2015
    Type
    Conference Paper
    
    Metadata
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    Citation
    Yoo, K. and Moon, G. 2015. Separation of Cu, Sn, Pb from copper scrap coated with Sn and Pb, pp. 514-518.
    Source Title
    EARTH 2015 - Proceedings of the 13th International Symposium on East Asian Resources Recycling Technology
    School
    Dept of Mining Eng & Metallurgical Eng
    URI
    http://hdl.handle.net/20.500.11937/53885
    Collection
    • Curtin Research Publications
    Abstract

    Tin/lead plating technologies have been used for unsurpassed solderability and in electrical and electronic equipments eliminating the potential for tin whisker formation. The present study is aimed at recovering of Cu, Sn, Pb, respectively, from the copper scrap coated with Pb and Sn. In the recycling process, tin was selectively leached from the scrap, and lead precipitated into PbCl2 powder. Because copper was not dissolved, so tin, lead, copper were recovered, respectively. The leaching tests were performed to investigate the effects of leaching conditions such as temperature, agitation speed, and oxidant concentration. In the process, the oxidant could be reused by electrical oxidation.

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