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dc.contributor.authorYoo, Kyoungkeun
dc.contributor.authorMoon, G.
dc.date.accessioned2017-06-23T03:01:48Z
dc.date.available2017-06-23T03:01:48Z
dc.date.created2017-06-19T03:39:36Z
dc.date.issued2015
dc.identifier.citationYoo, K. and Moon, G. 2015. Separation of Cu, Sn, Pb from copper scrap coated with Sn and Pb, pp. 514-518.
dc.identifier.urihttp://hdl.handle.net/20.500.11937/53885
dc.description.abstract

Tin/lead plating technologies have been used for unsurpassed solderability and in electrical and electronic equipments eliminating the potential for tin whisker formation. The present study is aimed at recovering of Cu, Sn, Pb, respectively, from the copper scrap coated with Pb and Sn. In the recycling process, tin was selectively leached from the scrap, and lead precipitated into PbCl2 powder. Because copper was not dissolved, so tin, lead, copper were recovered, respectively. The leaching tests were performed to investigate the effects of leaching conditions such as temperature, agitation speed, and oxidant concentration. In the process, the oxidant could be reused by electrical oxidation.

dc.titleSeparation of Cu, Sn, Pb from copper scrap coated with Sn and Pb
dc.typeConference Paper
dcterms.source.startPage514
dcterms.source.endPage518
dcterms.source.titleEARTH 2015 - Proceedings of the 13th International Symposium on East Asian Resources Recycling Technology
dcterms.source.seriesEARTH 2015 - Proceedings of the 13th International Symposium on East Asian Resources Recycling Technology
curtin.departmentDept of Mining Eng & Metallurgical Eng
curtin.accessStatusFulltext not available


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