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The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition

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Authors
Tadesse, Bogale
Horne, M.
Addai-Mensah, J.
Date
2013
Type
Journal Article

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Tadesse, B. and Horne, M. and Addai-Mensah, J. 2013. The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition. Journal of Applied Electrochemistry. 43 (12): pp. 1185-1195.
Source Title
Journal of Applied Electrochemistry
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School
Dept of Mining Eng & Metallurgical Eng
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