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dc.contributor.authorTadesse, Bogale
dc.contributor.authorHorne, M.
dc.contributor.authorAddai-Mensah, J.
dc.date.accessioned2017-11-20T08:49:39Z
dc.date.available2017-11-20T08:49:39Z
dc.date.created2017-11-20T08:13:35Z
dc.date.issued2013
dc.identifier.citationTadesse, B. and Horne, M. and Addai-Mensah, J. 2013. The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition. Journal of Applied Electrochemistry. 43 (12): pp. 1185-1195.
dc.identifier.urihttp://hdl.handle.net/20.500.11937/57940
dc.publisherSpringer Netherlands
dc.titleThe effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition
dc.typeJournal Article
dcterms.source.volume43
dcterms.source.number12
dcterms.source.startPage1185
dcterms.source.endPage1195
dcterms.source.issn0021-891X
dcterms.source.titleJournal of Applied Electrochemistry
curtin.departmentDept of Mining Eng & Metallurgical Eng
curtin.accessStatusFulltext not available


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