Released micromachined beams utilizing laterally uniform porosity porous silicon

Abstract

© 2014, Sun et al.; licensee Springer.

Abstract: Suspended micromachined porous silicon beams with laterally uniform porosity are reported, which have been fabricated using standard photolithography processes designed for compatibility with complementary metal-oxide-semiconductor (CMOS) processes. Anodization, annealing, reactive ion etching, repeated photolithography, lift off and electropolishing processes were used to release patterned porous silicon microbeams on a Si substrate. This is the first time that micromachined, suspended PS microbeams have been demonstrated with laterally uniform porosity, well-defined anchors and flat surfaces.

PACS: 81.16.-c; 81.16.Nd; 81.16.Rf