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    Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging

    134020_134020.pdf (107.9Kb)
    Access Status
    Open access
    Authors
    Debnath, Sujan
    Murthy, M.
    Seetharamu, K.
    Hassan, A.
    Date
    2009
    Type
    Conference Paper
    
    Metadata
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    Citation
    Debnath, S. and Murthy, M.V.V. and Seetharamu, K.N. and Hassan, A.Y. 2009. Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging, in University Technology Mara (ed), ICAME2009, Jun 24 2009, pp. 1313-1321. Concord Hotel, Shah Alam, Malaysia: University Technology Mara.
    Source Title
    ICAME2009
    Source Conference
    ICAME2009
    ISBN
    978-967-305-355-1
    Faculty
    Sarawak
    School of Engineering and Science
    Department of Mechanical Engineering
    Miri Campus
    School
    Curtin Sarawak - Faculty Office
    Remarks

    © Institute of Physics (the “Institute”) and IOP Publishing 2009.

    URI
    http://hdl.handle.net/20.500.11937/8560
    Collection
    • Curtin Research Publications
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