Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging
Citation
Debnath, S. and Murthy, M.V.V. and Seetharamu, K.N. and Hassan, A.Y. 2009. Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging, in University Technology Mara (ed), ICAME2009, Jun 24 2009, pp. 1313-1321. Concord Hotel, Shah Alam, Malaysia: University Technology Mara.
Source Title
ICAME2009
Source Conference
ICAME2009
ISBN
Faculty
Sarawak
School of Engineering and Science
Department of Mechanical Engineering
Miri Campus
School
Curtin Sarawak - Faculty Office
Remarks
© Institute of Physics (the “Institute”) and IOP Publishing 2009.