Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging
| dc.contributor.author | Debnath, Sujan | |
| dc.contributor.author | Murthy, M. | |
| dc.contributor.author | Seetharamu, K. | |
| dc.contributor.author | Hassan, A. | |
| dc.contributor.editor | University Technology Mara | |
| dc.date.accessioned | 2017-01-30T11:07:29Z | |
| dc.date.available | 2017-01-30T11:07:29Z | |
| dc.date.created | 2010-03-14T20:02:21Z | |
| dc.date.issued | 2009 | |
| dc.identifier.citation | Debnath, S. and Murthy, M.V.V. and Seetharamu, K.N. and Hassan, A.Y. 2009. Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging, in University Technology Mara (ed), ICAME2009, Jun 24 2009, pp. 1313-1321. Concord Hotel, Shah Alam, Malaysia: University Technology Mara. | |
| dc.identifier.uri | http://hdl.handle.net/20.500.11937/8560 | |
| dc.publisher | University Technology Mara | |
| dc.title | Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging | |
| dc.type | Conference Paper | |
| dcterms.source.startPage | 1313 | |
| dcterms.source.endPage | 1321 | |
| dcterms.source.title | ICAME2009 | |
| dcterms.source.series | ICAME2009 | |
| dcterms.source.isbn | 978-967-305-355-1 | |
| dcterms.source.conference | ICAME2009 | |
| dcterms.source.conference-start-date | Jun 24 2009 | |
| dcterms.source.conferencelocation | Concord Hotel, Shah Alam, Malaysia | |
| dcterms.source.place | University Technology Mara | |
| curtin.note |
© Institute of Physics (the “Institute”) and IOP Publishing 2009. | |
| curtin.department | Curtin Sarawak - Faculty Office | |
| curtin.accessStatus | Open access | |
| curtin.faculty | Sarawak | |
| curtin.faculty | School of Engineering and Science | |
| curtin.faculty | Department of Mechanical Engineering | |
| curtin.faculty | Miri Campus |