The thermally induced interfacial behavior of a thin two-dimensional decagonal quasicrystal film

Abstract

In this paper, the interfacial behavior of a thin two-dimensional decagonal quasicrystal (QC) film bonded on an elastic substrate is investigated due to a material mismatch strain under thermal variation. The non-slipping contact condition is assumed at interface. The Fourier transform technique is used to transfer the problem as an integral equation in terms of the phonon interfacial shear stress, which can be numerically solved by introducing the series expansion of Chebyshev polynomials. The expressions are explicitly presented for the phonon interfacial shear and internal normal stresses, the horizontal displacement of QC film, and the stress intensity factors. In the numerical calculation, the effects of material mismatch, the geometry of QC film, and temperature variation on the stresses, displacement and stress intensity factors are briefly discussed. It is expected that the results will be helpful to the design and safety assessment of a QC film/substrate system in engineering applications.