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    Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film

    Access Status
    Fulltext not available
    Authors
    Dang, H.
    Qi, D.
    Zhao, M.
    Fan, C.
    Lu, Chunsheng
    Date
    2023
    Type
    Journal Article
    
    Metadata
    Show full item record
    Citation
    Dang, H. and Qi, D. and Zhao, M. and Fan, C. and Lu, C.S. 2023. Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film. Applied Mathematics and Mechanics (English Edition). 44 (5): pp. 841-856.
    Source Title
    Applied Mathematics and Mechanics (English Edition)
    DOI
    10.1007/s10483-023-2989-7
    ISSN
    0253-4827
    Faculty
    Faculty of Science and Engineering
    School
    School of Civil and Mechanical Engineering
    URI
    http://hdl.handle.net/20.500.11937/94652
    Collection
    • Curtin Research Publications
    Abstract

    In this paper, we investigate the interfacial behavior of a thin one-dimensional (1D) hexagonal quasicrystal (QC) film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation. The contact interface is assumed to be non-slipping, with both perfectly bonded and debonded boundary conditions. The Fourier transform technique is adopted to establish the integral equations in terms of interfacial shear stress, which are solved as a linear algebraic system by approximating the unknown phonon interfacial shear stress via the series expansion of the Chebyshev polynomials. The expressions are explicitly obtained for the phonon interfacial shear stress, internal normal stress, and stress intensity factors (SIFs). Finally, based on numerical calculations, we briefly discuss the effects of the material mismatch, the geometry of the QC film, and the debonded length and location on stresses and SIFs.

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