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A modified layer-removal method for residual stress measurement in electrodeposited nickel films

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Open access
Authors
Jiang, L.
Peng, J.
Liao, Y.
Zhou, Y.C.
Liang, J.
Hao, H.X.
Lu, Chungsheng
Date
2011
Type
Journal Article

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Jiang, L.M. and Peng, J. and Liao, Y.G. and Zhou, Y.C. and Liang, J. and Hao, H.X. and Lu, C. 2011. A modified layer-removal method for residual stress measurement in electrodeposited nickel films. Thin Solid Films. 519 (10): pp. 3249-3253.
Source Title
Thin Solid Films
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Department of Mechanical Engineering
Remarks

NOTICE: This is the author’s version of a work that was accepted for publication in Thin Solid Films. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Thin Solid Films [519, 10, 2011] DOI http://dx.doi.org/10.1016/j.tsf.2011.01.260

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Abstract

Combining the traditional layer-removal method with a cantilever beam model, a modified layer-removal method is developed and used to measure residual stress in single and multi-layer electrodeposited nickel films with thickness of 2.5 μm. The out-of-plane displacement of the free tip of a cantilever beam is measured by the digital speckle correlation method. The results show that residual stress in a single semimat nickel film is compressive, while in a multi-layer system composed of dark, semimat and holophote nickel, residual stress in the surface layer is tensile. Residual stress decreases gradually with the increase of etching depths of single and multi-layer films. These findings are in qualitative agreement with nanoindentation tests, which confirms the reliability of the modified layer-removal method.