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dc.contributor.authorJiang, L.
dc.contributor.authorPeng, J.
dc.contributor.authorLiao, Y.
dc.contributor.authorZhou, Y.C.
dc.contributor.authorLiang, J.
dc.contributor.authorHao, H.X.
dc.contributor.authorLu, Chungsheng
dc.date.accessioned2017-01-30T12:08:07Z
dc.date.available2017-01-30T12:08:07Z
dc.date.created2011-03-17T20:01:35Z
dc.date.issued2011
dc.identifier.citationJiang, L.M. and Peng, J. and Liao, Y.G. and Zhou, Y.C. and Liang, J. and Hao, H.X. and Lu, C. 2011. A modified layer-removal method for residual stress measurement in electrodeposited nickel films. Thin Solid Films. 519 (10): pp. 3249-3253.
dc.identifier.urihttp://hdl.handle.net/20.500.11937/18476
dc.identifier.doi10.1016/j.tsf.2011.01.260
dc.description.abstract

Combining the traditional layer-removal method with a cantilever beam model, a modified layer-removal method is developed and used to measure residual stress in single and multi-layer electrodeposited nickel films with thickness of 2.5 μm. The out-of-plane displacement of the free tip of a cantilever beam is measured by the digital speckle correlation method. The results show that residual stress in a single semimat nickel film is compressive, while in a multi-layer system composed of dark, semimat and holophote nickel, residual stress in the surface layer is tensile. Residual stress decreases gradually with the increase of etching depths of single and multi-layer films. These findings are in qualitative agreement with nanoindentation tests, which confirms the reliability of the modified layer-removal method.

dc.publisherElsevier Science SA
dc.subjectResidual stress
dc.subjectNanoindentation
dc.subjectNickel
dc.subjectLayer-removal method
dc.subjectThin films
dc.titleA modified layer-removal method for residual stress measurement in electrodeposited nickel films
dc.typeJournal Article
dcterms.source.volume519
dcterms.source.number10
dcterms.source.startPage3249
dcterms.source.endPage3253
dcterms.source.issn0040-6090
dcterms.source.titleThin Solid Films
curtin.note

NOTICE: This is the author’s version of a work that was accepted for publication in Thin Solid Films. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Thin Solid Films [519, 10, 2011] DOI http://dx.doi.org/10.1016/j.tsf.2011.01.260

curtin.departmentDepartment of Mechanical Engineering
curtin.accessStatusOpen access


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