A modified layer-removal method for residual stress measurement in electrodeposited nickel films

Abstract

Combining the traditional layer-removal method with a cantilever beam model, a modified layer-removal method is developed and used to measure residual stress in single and multi-layer electrodeposited nickel films with thickness of 2.5 μm. The out-of-plane displacement of the free tip of a cantilever beam is measured by the digital speckle correlation method. The results show that residual stress in a single semimat nickel film is compressive, while in a multi-layer system composed of dark, semimat and holophote nickel, residual stress in the surface layer is tensile. Residual stress decreases gradually with the increase of etching depths of single and multi-layer films. These findings are in qualitative agreement with nanoindentation tests, which confirms the reliability of the modified layer-removal method.