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dc.contributor.authorDebnath, Sujan
dc.contributor.authorPang, X.
dc.contributor.authorRahman, Ekhlasur
dc.contributor.authorMoola, Mohan Reddy
dc.contributor.editorProf. A Kiet Tieu
dc.date.accessioned2017-01-30T15:26:26Z
dc.date.available2017-01-30T15:26:26Z
dc.date.created2013-03-05T20:00:32Z
dc.date.issued2012
dc.date.submitted2013-12-03
dc.identifier.citationSujan, D. and Pang, X.B. and Rahman, M.E. and Moola, M.R. 2012. Performance study of solder bond on thermal mismatch stresses in electronic packaging assembly, in Tieu, K. (ed), 15th International Conference on Advances in Materials & Processing Technologies Conference (AMPT 2012), Sep 23-26 2012. Wollongong, NSW: AMPT 2012.
dc.identifier.urihttp://hdl.handle.net/20.500.11937/46330
dc.description.abstract

Thermo-mechanical stresses have been considered as one of the major concern in electronic Packaging assembly structural failure. The interfacial stresses are often caused by the thermal mismatch stresses induced by the coefficient of thermal expansion (CTE) difference between materials, typically during the high temperature change in the bonding process. This research work examined the effect of bond layer on thermal mismatch inter-facial stresses in a bi-layered assembly. The paper verified the existing thermal mismatch solder bonded bi-layered analytical model using finite element method (FEM) simulation. The parametric studies on the effect of change of the bond layer properties were carried out in order to provide useful reference for interfacial stress evaluation and the electronic packaging assembly design. These parameters included CTE, temperature, thickness, and stiffness (compliant and stiff bond) of the bond layer. The recent development on the lead free bonding material was being reviewed and found to have enormous potential and key role to address the future electronic packaging assembly reliability.

dc.publisherAMPT2012
dc.titlePerformance study of solder bond on thermal mismatch stresses in electronic packaging assembly
dc.typeConference Paper
dcterms.dateSubmitted2013-03-06
dcterms.source.title15th International Conference on Advances in Materials & Processing Technologies Conference 2012 (AMPT 2012)
dcterms.source.series15th International Conference on Advances in Materials & Processing Technologies Conference 2012 (AMPT 2012)
dcterms.source.conference15th International Conference on Advances in Materials & Processing Technologies Conference 2012 (AMPT 2012)
dcterms.source.conferencedatesSep 23 2012
dcterms.source.conferencelocationUniversity of Wollongong, NSW, Australia
dcterms.source.placeUniversity of Wollongong, NSW, Australia
curtin.digitool.pid189690
curtin.pubStatusPublished
curtin.department
curtin.identifier.scriptidPUB-SAR-DIV-SD-71804
curtin.accessStatusOpen access


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