Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work
MetadataShow full item record
© 2018 The Authors, published by EDP Sciences. The study of thermal mismatch induced stresses and their role in mechanical failure is one relevant topic to composite materials, photonic devices and electronic packages. Therefore, an understanding of the nature of the interfacial stresses under different temperature conditions is necessary in order to minimize or eliminate the risk of mechanical failure. An accurate estimate of thermal stresses in the interfaces plays a significant role in the design and reliability studies of microelectronic devices. In the microelectronic industry, from a practical point of view, there is a need for simple and powerful analytical models to determine interfacial stresses in layered structures. This review paper summarizes the work conducted by the authors in relation to the bi-layered assembly with different temperature conditions on the determination of interfacial thermal stresses. The authors have extended the case of uniform temperature model by earlier researchers of two layered structure to account for differential uniform temperatures, linear temperature gradient in the layers. The presence of a heat source in one layer (die) is also presented. Finally, the effect of bond material properties and geometry on interfacial stresses and bond material selection approach are also considered in a simple way.
Showing items related by title, author, creator and subject.
Debnath, Sujan; Vincent, L.; Pok, Y. (2018)© 2018 The Authors, published by EDP Sciences. In electronic packaging, typically two or more thin dissimilar plates or layers are bonded together by an extremely thin adhesive bond layer. Electronic assemblies are usually ...
Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging AssemblyDebnath, Sujan; Vincent, L.; Pok, Y. (2018)© 2018 The Authors, published by EDP Sciences. Thermo-mechanical mismatch stress is one of the reasons for mechanical as well as functional failure between two or more connected devices. In electronic packaging, two or ...
Pok, Y.; Debnath, Sujan; Rahman, Muhammad; Dol, S. (2017)© The Authors, published by EDP Sciences, 2017. The flip chip bonding technology is widely used in electronic packaging as a result of improvements towards mechanical performance of layered structures. However, thermal ...