Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly
MetadataShow full item record
© 2018 The Authors, published by EDP Sciences. Thermo-mechanical mismatch stress is one of the reasons for mechanical as well as functional failure between two or more connected devices. In electronic packaging, two or more plates or layers are bonded together by an extremely thin layer. This thin bonding layer works as an interfacial stress compliance which is expected to alleviate the interfacial stresses between the layers. Therefore, it is very important to identify the suitable interfacial bonding characteristics for reducing the interfacial thermal mismatch stresses to maintain the structural integrity. This research work examines the influences of bond layer properties and geometry on the interfacial shearing and peeling stresses in a bi-material assembly. In this study a closed form model of bi-layered assembly is used with the up-to-date bond layer shear stress compliance expression. The key bond layer properties namely Young's modulus, coefficient of thermal expansion, Poisson's ratio, and physical parameters like temperature and thickness are considered for interfacial stress evaluation. It is observed that the Young's modulus, the thickness and the temperature of the bond layer have significant influence on the interfacial shearing and peeling stress. The results obtained are likely to be useful in designing bond layer properties in microelectronics and photonics applications.
Showing items related by title, author, creator and subject.
Debnath, Sujan; Vincent, L.; Pok, Y. (2018)© 2018 The Authors, published by EDP Sciences. In electronic packaging, typically two or more thin dissimilar plates or layers are bonded together by an extremely thin adhesive bond layer. Electronic assemblies are usually ...
Pok, Y.; Debnath, Sujan; Rahman, Muhammad; Dol, S. (2017)© The Authors, published by EDP Sciences, 2017. The flip chip bonding technology is widely used in electronic packaging as a result of improvements towards mechanical performance of layered structures. However, thermal ...
Debnath, Sujan; Pang, X.; Rahman, Ekhlasur; Moola, Mohan Reddy (2012)Thermo-mechanical stresses have been considered as one of the major concern in electronic Packaging assembly structural failure. The interfacial stresses are often caused by the thermal mismatch stresses induced by the ...