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dc.contributor.authorDang, H.Y.
dc.contributor.authorQi, D.P.
dc.contributor.authorFan, C.Y.
dc.contributor.authorLu, Chunsheng
dc.contributor.authorZhao, M.H.
dc.identifier.citationDang, H.Y. and Qi, D.P. and Fan, C.Y. and Lu, C. and Zhao, M.H. 2024. On the interfacial behavior of two-dimensional decagonal quasicrystal films with an adhesive layer due to thermal misfit. Engineering Fracture Mechanics. 303.

The interfacial behavior of a thin two-dimensional decagonal quasicrystal (QC) film bonded to a half plane with an adhesive layer is analyzed under thermal misfit. Under a perfect non-slipping contact condition at interface, a theoretical model is established based on the membrane assumption, with the governing integral–differential equations being constructed in terms of phonon interfacial shear stresses in one single and multiple films. Then, these governing equations are numerically solved by Chebyshev polynomials, obtaining the phonon interfacial shear and internal normal stresses as well as the longitudinal displacement in the QC film. Finally, the effects of neighboring films, material mismatch, adhesive layer, the geometry of QC film, and temperature variation are briefly discussed on the interfacial response. It is found that the adhesive layer plays as a softening medium which can greatly reduce the value of normal and shear stresses and weaken the singularity of shear stresses near the ends of films. These findings will be instructive to the accurate measurement and safety monitoring of QC films.

dc.titleOn the interfacial behavior of two-dimensional decagonal quasicrystal films with an adhesive layer due to thermal misfit
dc.typeJournal Article
dcterms.source.titleEngineering Fracture Mechanics
curtin.departmentSchool of Civil and Mechanical Engineering
curtin.accessStatusIn process
curtin.facultyFaculty of Science and Engineering
curtin.contributor.orcidLu, Chunsheng [0000-0002-7368-8104]
curtin.contributor.scopusauthoridLu, Chunsheng [57061177000]

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