Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly
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The thermal mismatch induced interfacial stresses are one of the major reliability issues in electronic packaging and composite materials. Consequently an understanding of the nature of the interfacial stresses under different temperature conditions is essential in order to eliminate or reduce the risk of structural and functional failure. Approach: In this analysis, a model was proposed for the shearing and peeling stresses occurring at the interface of two bonded dissimilar materials with the effect of different uniform temperatures in the layers. The model was then upgraded by accounting thickness wise linear temperature gradients in the layers using two temperature drop ratios. The upgraded models were then compared with the existing uniform temperature model. The proposed model can be seen as a more generalized form to predict interfacial stresses at different temperature conditions that may occur in the layers. Results: The results were presented for an electronic bi-material package consisting of die and die-attach. Conclusion: The numerical simulation is in a good matching agreement with analytical results.
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Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's WorkDebnath, Sujan; Vincent, L.; Pok, Y. (2018)© 2018 The Authors, published by EDP Sciences. The study of thermal mismatch induced stresses and their role in mechanical failure is one relevant topic to composite materials, photonic devices and electronic packages. ...
Debnath, Sujan; Vincent, L.; Pok, Y. (2018)© 2018 The Authors, published by EDP Sciences. In electronic packaging, typically two or more thin dissimilar plates or layers are bonded together by an extremely thin adhesive bond layer. Electronic assemblies are usually ...
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